Diamino
methyl cyclohexane 1,3 BAC C260 (H2NCH2) 2C6H8 brown liquid standard
resin per 100 parts with 18 parts of the cyclic polyamine at room
temperature can not be completely cured, the need for curing 80-150
° C, obtained HDT TAT 150 ℃. Often need to add a promoting agent:
tertiary amines, triphenyl phosphite, salicylic acid, p-cresol.
Meng the alkoxy diamines MDA (CH3) (H2N) C6H8 C (CH3) 2NH2 MW 169
active hydrogen equivalent of 42.2 per 100 parts of a pale yellow
liquid resin with 6-22 parts by heating curing the applicable period
of 80 to 130 ° C, 2 hours and 30 minutes 50 g 25 ° C for 8-16 hours
long. Heat distortion temperature of 148-158 ℃ bending strength
1050-1190kg/cm2, compressive strength 710kg/cm2, tensile strength
610kg/cm2, 2.9% elongation, impact strength of 0.4 foot - lbs / inch
Rockwell hardness of 105. Low viscosity, for a long period. Heated
rapidly curing toxicity.
Aminoethyl piperazine AEP H2NC2H4N2C4H9 MW 129 active hydrogen
equivalent of 43 as a colorless liquid per 100 parts by standard
resin cured for 3 days -30 minutes applicable period of 50 g of 25 ℃
30 minutes, with 13-23 parts by normal -200 ℃ thermal deformation
temperature of 100 - 120 ℃ compressive strength 590kg/cm2, tensile
strength 610kg/cm2, 8.8% elongation, impact strength 1-1.2 feet -
lbs / inch Rockwell hardness 95-105. Can be cured at room
temperature, heat capacity, for a short period. Good impact
resistance
Hexahydropyrido HHP NC5H11 MW 85 active hydrogen equivalents of 85
as a colorless liquid, per 100 parts by standard resin with 5-7
parts
Isophorone diamine of IPDA (CH3) 2 C6H3 (CH3) (CH2NH2) molecular
weight of 169 and an active hydrogen equivalent of 42.2 as a
colorless liquid, per 100 parts by standard resin cured with 24
parts of a 80 ℃ 4 hours +150 ° C 4 hours, at room temperature 24
hours. Performance: of 400 g 25 ° C 75 minutes, or 50 ° C 10-15
minutes, the the Martin heat resistance 135 ° C (the thermal
deformation temperature of 149 ° C), bending strength 1250kg/cm2
impact strength 17Kg-cm/cm2 tensile strength of 730 kg / cm2, the
elongation at break 3.6 TG δ 0.002 (25 ° C, 100C / S), the surface
resistance is greater than the volume resistivity of 1012Ω (1000V)
is greater than 1016Ω.cm (1000V) a dielectric constant (50 Hz and 23
° C) 3.78 Power Factor (50 He 23 ℃) 0.002 temperature cure, low
temperature performance.
Diamino cyclohexane DAHM (NH2) 2 C6H4 molecular weight of 112
colorless liquid active hydrogen equivalent of 28 per 100 standard
resin with 14-16 curing at room temperature 7 days at 70 ° C, 2
hours.
Two aminomethyl ring group the methane DAMHM C-260 [(NH2) (CH3)
C6H4] 2CH2 molecular weight of 232 per 100 parts of the active
hydrogen equivalent of 58 as a colorless liquid standard resin cured
with 33 parts 80 ℃ 2 hours +150 ° C 2 hours thermal a the 130-150 ℃
flexural strength of the deformation temperature 1070kg/cm2, the
tensile strength of 770 kg/cm2, the power factor of the dielectric
constant (50 Hz and 23 ° C) 4.0 (50 Hz and 23 ° C) 0.005 volume
resistivity greater than 2x1016Ω.cm
Two amino cyclohexyl methane DACHM, [(NH2) C6H4] 2CH2 MW 206 active
hydrogen equivalents 51.5 melting point of 40 ° C per 100 parts by
standard resin cured with 30 parts of 60 ℃ 3 hours +150 ℃ 2
hours.Inter-phenylenediamine m-PDA MPD (NH2) 2C6H4 molecular weight
of 107 active hydrogen equivalent the 26.7 white crystalline (black
solid?) Melting point of 62 ° C for every 100 parts of standard
resins 14-16 were cured +150 ℃ 2 hours, 60 ℃ 2 hours applies
flexural strength of 500 g of 50 ° C 2.5 hours of thermal
deformation temperature of 150 ℃ 1050kg/cm2, compressive strength
710kg/cm2, tensile strength 540kg/cm2, 3.0% elongation, impact
strength 0.2-0.3 feet - lbs / inch Rockwell hardness of 108.
Dielectric constant (50 Hz and 23 ° C) 3.3 power factor (50 Hz and
23 ° C) 0.007 heat resistance, excellent corrosion resistance, good
electrical properties, and low toxicity. Due to the solid,
inconvenient to use, the need to pay attention to prevent the gel
when heated and mixed with the resin.
Xylylenediamine-MXDA to (NH2CH2) C6H4 MW 135 active hydrogen
equivalent 33.2 standard resin per 100 parts of colorless liquid
with 16-18 parts of the curing room temperature 24 hours +70 ° C for
1 hour or room temperature for 4 days. Flexural strength of 100 g of
the applicable period of thermal deformation temperature of 130-150
℃, 25 ℃ 50 minutes 1200kg/cm2, compressive strength 1030kg/cm2,
tensile strength 720kg/cm2 elongation of 6.7%, the dielectric
constant (50 Hz and 23 ℃ ) 4.0 power factor (50 Hz and 23 ° C) the
0.005 volume resistivity greater than 2x1016Ω.cm room temperature
curing heat resistance, excellent corrosion resistance, electrical
properties, and toxicity. Low temperature curing, low viscosity, low
toxicity, and for a long period, good solvent resistance. It is easy
to absorb carbon dioxide in the air caused by products bubble
reasons.
Diaminodiphenyl diphenylmethane DDMs HT-972 of DEH-50 [(NH2) (CH3)
C6H4] 2CH2 MW 196 active hydrogen equivalent 49 white crystals brown
m.p. 89 ° C per 100 parts by standard resin is exposed to sunlight
for a long time was 25-30 copies of curing 60 ℃ 2 h +150 ℃ 2 hours.
500 g of the applicable period of 50 ℃ 3 hours a heat distortion
temperature of 145-150 ℃ the flexural strength 1190kg/cm2,
compressive strength 710kg/cm2, tensile strength 550kg/cm2 4.4%
elongation, impact strength of 0.3 to 0.5 feet - pounds / inch
Rockwell hardness of 106. 4.4 power factor of the dielectric
constant (50 Hz and 23 ° C) (50 Hz and 23 ° C) the 0.004 volume
resistance greater than 1015Ω.cm heat resistance, excellent
corrosion resistance, good electrical properties, low toxicity. Heat
resistance, high mechanical strength. Due to the solid, inconvenient
to use, the need to pay attention to prevent the gel when heated and
mixed with the resin.
Diaminodiphenyl sulfone DDS HT-976 [(NH2) C6H4] 2SO2 MW 248 active
hydrogen equivalents 62 mp 175 ° C per 100 parts by standard resin
cured with a 35-40 parts by 130-150 ° C, 3 days 2 hours. Applicable
period 500 g of 130 ° C for 1.5 hours is usually BF3-amine
complexes, the accelerator (an amount of 0.5-2%) the 175-190 ℃
bending strength of the thermal deformation temperature of
1220kg/cm2, the compressive strength of 710kg/cm2, tensile
580kg/cm2, strength and elongation of 3.3%, the impact strength of
0.3 to 0.5 feet - pounds / inch Rockwell hardness of 110. Good heat
resistance, excellent corrosion resistance, electrical properties,
and toxicity. Slow response. Heat-resistant 175 ℃.
Between amino MAMA (NH2), methylamine (CH2NH2) C6H4 molecular weight
of 123 active hydrogen equivalent of 30.7 melting point of 38 ° C
per 100 parts of the standard resin curing 130-150 ℃ 3 days - 2
hours with 14-18 copies. The high elongation at break.
Associated aniline (NH2) C6H4 C6H4 (NH2)
4 - chloro-o-phenylenediamine CPDA (NH2) 2C6H3 CL
Xylylenediamine trimer GY-51 CH-2 viscosity at 60 ° C 2000-6000cps
per 100 parts by standard resin with 30-60 parts by curing at room
temperature -60 ° C for 7 days -1 hour. Low toxicity. WA-060 CH-3
Viscosity 60 ℃ 6000-10000cps standard resin per 100 parts 30-60 were
cured at room temperature -60 ℃ 7 days 1 hour.
Xylylenediamine trimer derivatives viscosity 25 ° C 5cps 40cps, 100
cps standard resin with 25-30 parts per 100 parts of curing at room
temperature -60 ° C for 7 days and 1 hour. Low viscosity. Low
toxicity.
Double benzylamino ether (H2NCH2C6H4) 2O, per 100 parts by standard
resin with 30-60 parts of room temperature curable, for a long
period, low exotherm, heat distortion temperature of 68 ° C.
M-phenylene diamine and diaminodiphenyl methane mixture is 60-75%
MPDA with 40-25% DDM molten mixture that is liquid at ordinary
temperature. 40:60 diaminodiphenyl methane, and m-phenylenediamine
mixture m.p. 25 ℃, standard resin with 20 parts per 100 parts at 40
° C after 5 hours the epoxy curing. Plus triphenyl phosphite and
phenol mixture at 20 ° C for 9 hours, i.e. cured. Thermal
deformation temperature of 150 ° C flexural strength 1150kg/cm2,
impact strength 17Kg-cm/cm2 tensile strength of 560 kg/cm2, the
dielectric constant (50 Hz and 23 ° C), elongation at break 4.8
Rockwell hardness 105-110 4.5 power factor ( 50 Hz and 23 ℃) 0.006
Inter-phenylene diamine and a mixture of diaminodiphenyl methane and
toluene diamine, p-phenylenediamine: diaminodiphenyl methane:
toluene diamine = 30-70:10-50:5-35 a mixture of a stable liquid .
Example 50 parts of p-phenylenediamine, 30 parts of diamino diphenyl
methane, 20 parts of toluene diamine (meta: para = 80:20) 100 ° C
obtained by mixing a liquid, the stable period of 9 months. Per 100
standard resin cured with 18.5 parts of 80 ℃ 2 h +140 ℃ 2 hours. The
impact strength 115Kg-cm/cm2, Rockwell hardness 105.
O-toluenediamine, m-toluene diamine and diamino diphenyl methane
mixture and their ratio of 26:14:60, does not precipitate at 23 ° C
for 48 hours, 45 minutes at 23 ℃ gel with an epoxy resin.
Diaminodiphenyl methane and isophorone diamine mixture is 40-30% DDM
and 60-70% IPDA molten mixture that is liquid at ordinary
temperature. When the standard resin per 100 parts of the 40% DDM
and 60% IPDA mixed with a mixture of 25 parts, a heat distortion
temperature of 130-155 ° C the NATURAL flexural strength 1160kg/cm2,
dielectric constant (50 Hz and 23 ° C) (50 Hz, 3.4 power factor 23 °
C) 0.012
